Materials： Polyimide
Layers： 1L 2L 4L 6L
Min. Line/Track space： >=100um(4mil) >=75um(3mil)
Min.Hole size： >=0.2mm >=0.15mm
Inner finished copper： 12um(1/3OZ) 18um(0.5OZ) 35um(1OZ)
Out finished Copper： 12um(1/3OZ) 18um(0.5OZ) 35um(1OZ)
Base Film Thickness： 12.5um 25um 35um 50um
Panel-Type： Single layout 1x1 Arrays layouts 1 panel = pcs
Panel Size： x mm
Quantities： QTY one - QTY two - QTY three - QTY four pcs (*you can quote for four different quantities' price at the same time)
Surface： OSP ENIG(Chem.gold) (AU=1u″)
SolderMask： With cover film Green solder resist White solder resist Black solder resist
Silk Screen： White Black None
Shipping Costs： Charged by shipper Charged by receiver
Currency： USD EUR
